Description

This premium perfboard is designed for rapid prototyping and permanent circuit assembly, providing a high-quality foundation for your electronic projects. Unlike standard perfboards, this board features a durable ENIG (Electroless Nickel Immersion Gold) finish, ensuring superior solderability, oxidation resistance, and long-term reliability compared to alternatives.

Manufactured using high-temperature FR4 (Tg150), this board withstands repeated lead-free and leaded soldering, high heat exposure, and rework cycles without warping or delaminating. With an extended operating range of –40°C to +120°C, this perfboard is ideal for demanding environments where reliability matters.

Each hole is precisely spaced on a 0.1in grid, maintaining compatibility with a wide variety of components, including DIP ICs, headers, and other through-hole devices. The octagonal pads provide a strong mechanical and electrical connection, reducing the risk of lifted pads during soldering. Strategically placed extended pads allow for easy soldering of headers.

A dual-layer black solder mask not only enhances aesthetics but also minimizes accidental solder bridging, making assembly easier and cleaner. The board also includes four mounting holes for secure fixture installation in enclosures.

Specifications

Application Guidance

GENERAL

Perfboards are a versatile platform for building electronic prototypes using both through-hole technology (THT) and select surface-mount technology (SMT) components. The standard 0.1 in (2.54 mm) grid spacing of plated solder holes supports a wide range of common THT components, including resistors, capacitors, ICs, and connectors.

For SMT components, certain packages—such as 1206, 0805, or similar passive parts—can be mounted between adjacent pads, enabling creative layout solutions when needed. While not designed specifically for SMT, perfboards offer flexibility for low-density surface-mount experimentation and hybrid builds.

These boards are compatible with both leaded and lead-free solder. Thanks to the high-Tg FR4 substrate, they can endure repeated soldering and rework cycles without delamination—provided soldering temperature and dwell times remain within specified limits. This makes them ideal for prototyping, small-scale production, and educational use.

BOARD MOUNTING

The mounting holes are compatible with #4 or M3 screws. For best results, use standoffs or spacers with thin wall profiles to avoid interference with adjacent solderable pads. If such hardware is unavailable, simply leave the nearby solder holes electrically isolated and unsoldered to prevent accidental shorting.

For larger perfboards, mechanical bowing may occur, particularly when perpendicular forces are applied—such as when using vertical connectors. In these cases, it is recommended to install bumpers or supports between the board and its mounting surface to absorb mechanical stress and maintain rigidity. This is especially important in high-vibration environments or when dealing with frequent insertion/removal cycles.

WIRING

Wiring to and from the perfboard is best accomplished using pin headers or connectors. These allow for quick, reliable connections and simplify integration with other boards or systems. If connectors are not feasible, it is recommended to apply strain relief near solder joints—using glue, epoxy, or a mechanical brace—to protect against fatigue or failure during extended testing or handling.

This perfboard includes extended pads around its perimeter, which are spaced at the standard 0.1 in (2.54 mm) pitch to accommodate common pin headers. These pads are ideal for connecting to DuPont-style jumper wires or other socketed cables, making setup and teardown easy during prototyping and evaluation.

Refer to the images below for wiring examples and usage suggestions.

Documentation

Datasheet

3D PDF